Wafer dicing is one of the processes popular in the semiconductor industry. It is a way of isolating a die from a wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, with the help of dicing cutting blades.
‘Wafer dicing methods’
Scribing and breaking — usually is done in a substrate made of a brittle material by which good-quality cutting surface of the substrate may be accomplished without any flaws such as chippings on the substrate. This method of semiconductor wafer splitting up is accomplished by creating a stress in the wafer and then fracturing the wafer along the stress line. A line must be created in the wafer surface along the street where the break is desired.
Mechanical sawing — the process is done using a mechanical machine called dicing saw; this method is used for a tiny electro-mechanical system semiconductor devices. While it is possible to manufacturers that make use of this method, it is slowly getting unpopular because of several disadvantages — the process is slow, contaminant-laden, and dependent on regular shapes.
Laser cutting — a new and more effective technology to cut semiconductor materials; the process operates by directing the output of a high-power laser at the material to be cut. This process burns or vaporizes away the unwanted parts, leaving an edge with a high-quality surface finish. Cats Eye Dice
As mentioned above, dicing cutting blades are used and are an important element for the dicing process. There are several types of dicing cutting blades and some of them are the following:
Hubbed Pennie Bonded Cutting blades — this is used to cut Silicon and III-V materials. This blade is ultra-thin and made out of a special electrodepositing strategy to support the cutting diamonds in a pennie alloy matrix.
Hubbed Resin Bonded Cutting blades — with this type of blade, there is no need to buy expensive flanges as the resinoid blade is permanently mounted to its center. As opposed to flanges, once the blade is dressed, it can be indifferent and reattached again without going through the attire process.
Hubless Resin Bonden Cutting blades — this type of dicing blade performs very well on materials like ceramic, quartz, sapphire and glass. This can give minimum chipping and superior finish.
Metal Sintered Dicing Cutting blades — this is a type of blade that has been created by capturing diamonds in a metal binder using sintering process — this is a very rigid blade and has a very low wear rates. These properties offer the ability to create very straight cuts even when subjected to large exposures.